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MSK5920-3.3KRHU Fiches technique(PDF) 4 Page - M.S. Kennedy Corporation

No de pièce MSK5920-3.3KRHU
Description  RAD TOLERANT ULTRA LOW DROPOUT POSITIVE LINEAR REGULATOR
Download  7 Pages
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Fabricant  MSK [M.S. Kennedy Corporation]
Site Internet  http://www.mskennedy.com
Logo MSK - M.S. Kennedy Corporation

MSK5920-3.3KRHU Fiches technique(HTML) 4 Page - M.S. Kennedy Corporation

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APPLICATION NOTES CONT.
4
HEAT SINK SELECTION
To select a heat sink for the MSK 5920RH, the follow-
ing formula for convective heat flow may be used.
Governing Equation:
TJ = PD X (R
θJC + RθCS + RθSA) + TA
Where
TJ
= Junction Temperature
PD
= Total Power Dissipation
R
θJC
= Junction to Case Thermal Resistance
R
θCS = Case to Heat Sink Thermal Resistance
R
θSA = Heat Sink to Ambient Thermal Resistance
TA
= Ambient Temperature
Power Dissipation=(VIN-VOUT) x IOUT
Next, the user must select a maximum junction tem-
perature. The absolute maximum allowable junction tem-
perature is 150°C. The equation may now be rearranged
to solve for the required heat sink to ambient thermal
resistance (R
θSA).
Example:
An MSK 5920-2.5RH is connected for VIN=+3.3V and
VOUT=+2.5V. IOUT is a continuous 3A DC level. The am-
bient temperature is +25°C. The maximum desired junc-
tion temperature is +125°C.
R
θJC=4.0°C/W and RθCS=0.15°C/W for most thermal
greases
Power Dissipation=(3.3V-2.5V) x (3A)
=2.4 Watts
Solve for R
θSA:
125°C - 25°C
2.4W
= 36.5°C/W
In this example, a heat sink with a thermal resistance
of no more than 36.5°C/W must be used to maintain a
junction temperature of no more than 125°C.
THERMAL LIMITING
The MSK 5920RH control circuitry has a thermal shut-
down temperature of approximately 150°C. This ther-
mal shutdown can be used as a protection feature, but
for continuous operation, the junction temperature of the
pass transistor must be maintained below 150°C. Proper
heat sink selection is essential to maintain these condi-
tions.
TYPICAL APPLICATIONS CIRCUIT
R
θSA=
-4.0°C/W - 0.15°C/W
FIGURE 2
Rev. G
1/06


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