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HCPL-T251-500 Fiches technique(PDF) 3 Page - Agilent(Hewlett-Packard) |
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HCPL-T251-500 Fiches technique(HTML) 3 Page - Agilent(Hewlett-Packard) |
3 / 6 page 3 Regulatory Information The HCPL-T251 is under approval by the following organizations: UL Approval under UL 1577, Component Recognition Program, File E55361. Insulation and Safety Related Parameter Symbol Value Units Conditions Minimum External Air Gap L(101) 7.1 mm Measured from input terminals to (Clearance) output terminals, shortest distance through air. Minimum External Tracking L(102) 7.4 mm Measured from input terminals to (Creepage) output terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.08 mm Insulation thickness between emitter (Internal Clearance) and detector; also known as distance through insulation Tracking Resistance CTI ≥ 175 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Absolute Maximum Ratings (Compared with HCPL-3140) HCPL-3140 HCPL-T251 Parameter Symbol Units Min. Max. Min. Max. Note Operating Temperature TA °C - 40 100 -20 85 “High” Peak Output Current IOH(PEAK) A 0.6 0.4 1 “High” Peak Output Current IOL(PEAK) A 0.6 0.4 Storage Temperature TS °C -55 125 -55 125 Average Input Current IF(AVG) mA 25 20 2 Peak Transient Input Current IF(TRAN) A 1.0 1.0 (<1 µs Pulse Width, 300 pps) Reverse Input Voltage VR V5 5 Supply Voltage (VCC - VEE) V -0.5 35 -0.5 35 Output Voltage VO V0 VCC 0VCC Output Power Dissipation PO mW 250 250 3 Lead Solder Temperature 260 °C for 10 sec., 1.6 mm below seating plane Solder Reflow Temperature Profile See Package Outline Drawings section Notes: 1. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%. 2. Derate linearly above 70 °C free-air temperature at a rate of 0.3 mA/°C. 3. Derate lineraly above 70 °C free-air temperature at a rate of 4.8 mW/°C. CSA Approval under CSA Component Acceptance Notice #5, File CA 88324. |
Numéro de pièce similaire - HCPL-T251-500 |
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Description similaire - HCPL-T251-500 |
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