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BD64547MUV Fiches technique(PDF) 30 Page - Rohm

No de pièce BD64547MUV
Description  System Motor Driver
Download  39 Pages
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Fabricant  ROHM [Rohm]
Site Internet  http://www.rohm.com
Logo ROHM - Rohm

BD64547MUV Fiches technique(HTML) 30 Page - Rohm

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TSZ02201-0P2P0C001400-1-2
16.Nov.2020 Rev.006
TSZ22111 • 15 • 001
30/36
BD64547MUV
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
Power Dissipation
VQFN048V7070 is designed with a heat sink metal on the backside of IC to perform heat dissipation treatment using
through hole from backside. Before use, be sure to connect to the GND plane on the board with solder and make the GND
pattern as wide as possible to secure a sufficient heat dissipation area. Note that the power dissipation described below
may not be assured when not connecting by solder. The back metal is shorted with the backside of the IC chip that is a GND
potential. There is a possibility for malfunction or destruction if it is shorted with any potential other than GND, which should
be avoided.
Please note that it has been assumed that this product will be used in the condition of this back metal
performed heat dissipation treatment for increasing heat dissipation efficiency.
Figure 35. Thermal Derating Curve
(VQFN048V7070)
Package thermal resistor
Board
θJA [°C/W]
Board A
240.4
Board B
107.8
Board C
29.1
Board D
25.9
PCB size: 74.2 mm x 74.2 mm x 1.6 mmt
(): Copper foil pattern area size
Board A: Package only
Board B: 1 layer PCB (1 layer: 34.09 mm2)
Board C: 4 layer PCB (1, 4 layer: 34.09 mm2. 2, 3 layer: 5505 mm2)
Board D: 4 layer PCB (all layers: 5505 mm2)
Values in derating curve and packaged thermal resistor are tested values
0.0
1.0
2.0
3.0
4.0
5.0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
D 4.83 W
B 1.16 W
A 0.51 W
C 4.29 W


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