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BD64547MUV Fiches technique(PDF) 30 Page - Rohm |
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BD64547MUV Fiches technique(HTML) 30 Page - Rohm |
30 / 39 page TSZ02201-0P2P0C001400-1-2 16.Nov.2020 Rev.006 TSZ22111 • 15 • 001 30/36 BD64547MUV © 2015 ROHM Co., Ltd. All rights reserved. www.rohm.com Power Dissipation VQFN048V7070 is designed with a heat sink metal on the backside of IC to perform heat dissipation treatment using through hole from backside. Before use, be sure to connect to the GND plane on the board with solder and make the GND pattern as wide as possible to secure a sufficient heat dissipation area. Note that the power dissipation described below may not be assured when not connecting by solder. The back metal is shorted with the backside of the IC chip that is a GND potential. There is a possibility for malfunction or destruction if it is shorted with any potential other than GND, which should be avoided. Please note that it has been assumed that this product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation efficiency. Figure 35. Thermal Derating Curve (VQFN048V7070) Package thermal resistor Board θJA [°C/W] Board A 240.4 Board B 107.8 Board C 29.1 Board D 25.9 PCB size: 74.2 mm x 74.2 mm x 1.6 mmt (): Copper foil pattern area size Board A: Package only Board B: 1 layer PCB (1 layer: 34.09 mm2) Board C: 4 layer PCB (1, 4 layer: 34.09 mm2. 2, 3 layer: 5505 mm2) Board D: 4 layer PCB (all layers: 5505 mm2) Values in derating curve and packaged thermal resistor are tested values 0.0 1.0 2.0 3.0 4.0 5.0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE [°C] D 4.83 W B 1.16 W A 0.51 W C 4.29 W |
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