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MC33797 Fiches technique(PDF) 5 Page - Freescale Semiconductor, Inc

No de pièce MC33797
Description  Four Channel Squib Driver IC
Download  32 Pages
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Fabricant  FREESCALE [Freescale Semiconductor, Inc]
Site Internet  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MC33797 Fiches technique(HTML) 5 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33797
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings (1)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
INPUT ELECTRICAL RATINGS
Voltage on VDD
VDD
7.0
V
Voltage on Input terminals CS, CLK, D1, D0, FEN_1, FEN_2, RESETB,
R_DIAG, R_LIMIT_X
VI
-0.3 to VDD + 0.3
V
Voltage on Squib terminals SQB_HI_XX, SQB_LO_XX, SENSE_XX
VVFIRE_XX
-0.3 to VVFIRE + 0.3
V
Voltage on terminals VDIAG_X, VFIRE_XX
VDIAG_X
-0.3 to 35
V
ESD Voltage
Human Body Model (2)
Machine Model (3)
VESD1
VESD2
±2000
±200
V
Maximum VVFIRE with Pulsed Output (4), (5)
RSQUIB = 2.0 Ω, tON = 0.8 ms, ISQUIB = 2.24 A
RSQUIB = 1.2 Ω, tON = 0.8 ms, ISQUIB = 2.24 A
RSQUIB = 0.1 Ω, tON = 0.60 ms, ISQUIB = 2.24 A
VFPULSE
35
25
25
V
THERMAL RATINGS
Storage Temperature
TSTG
155
°C
Junction Temperature Ambient
Continuous (Prior to Squib Deployment)
t
≤ 5.0 ms (Post-Squib Deployment)
TA
TJCONT
TJDPYD
85
100
300
°C
Lead Soldering Temperature (6)
TSOLDER
245
°C
Thermal Resistance (Junction-to-Ambient)
RθJ-A
74
°C/W
OPERATING RATINGS (7)
Low-Side FET Fire Conditions
RSQUIB
tON
ISQUIB
VSQUIBHI
2.0
2.6 ms
3.0 A
16 V
1.2
2.6 ms
3.0 A
16 V
0.1
2.6 ms
3.0 A
16 V
Notes
1.
Absolute maximum ratings indicate limits beyond which damage to the device may occur.
2.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).
3.
ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
4.
With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.
The individual squib driver thermal shutdown will not affect other squib driver firing “ON” times. With a shorted squib load, the FET squib
driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is
exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the
arm/fire command when the TEMPRENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load is 2.15 Ω ±0.15 Ω.
Shorted squib load is 0.1
Ω.
5.
Three-squib driver with RSQUIB = 0.1 Ω conditions. Remaining squib driver conditions: RSQUIB =1.2 Ω, tON = 4.0 ms, ISQUIB =2.0 A,
VVDIAG_X =VVFIRE_XX =35V.
6.
Lead soldering temperature limit is for 10 seconds maximum duration; not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
7.
Operating ratings indicate conditions for which the device is intended to be functional. For guaranteed specifications and test conditions,
refer to the static and dynamic electrical characteristics tables on the following pages.


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