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SN74HCS259-Q1 Fiches technique(PDF) 4 Page - Texas Instruments

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No de pièce SN74HCS259-Q1
Description  SN74HCS259-Q1 Automotive 8-Bit Addressable Latches with Schmitt-Trigger Inputs
Download  24 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

SN74HCS259-Q1 Fiches technique(HTML) 4 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input clamp current(2)
VI < –0.5 V or VI > VCC + 0.5 V
±20
mA
IOK
Output clamp current(2)
VI < –0.5 V or VI > VCC + 0.5 V
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
Continuous current through VCC or GND
±70
mA
TJ
Junction temperature(3)
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
Guaranteed by design.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 2
±4000
V
Charged device model (CDM), per AEC
Q100-011 CDM ESD Classification Level C6
±1500
(1)
AEC Q100-002 indicate that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
TA
Ambient temperature
–40
125
°C
6.4 Thermal Information
THERMAL METRIC(1)
SN74HCS259-Q1
UNIT
PW (TSSOP)
D (SOIC)
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
141.2
122.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
78.8
80.9
°C/W
RθJB
Junction-to-board thermal resistance
85.8
80.6
°C/W
ΨJT
Junction-to-top characterization parameter
27.7
40.4
°C/W
ΨJB
Junction-to-board characterization parameter
85.5
80.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
SN74HCS259-Q1
SCLS815 – JULY 2020
www.ti.com
4
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