DRV8889-Q1_V02 datasheet(66/88 Pages) TI

No de pièce	DRV8889-Q1

Description	DRV8889-Q1, DRV8889A-Q1 Automotive Stepper Driver with Integrated Current Sense, 1/256 Micro-Stepping, and Stall Detection

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Fabricant	TI [Texas Instruments]

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Figure 8-19. 2-Layer PCB Junction-to-Ambient

Thermal Resistance (RθJA) vs Copper Area

Figure 8-20. 2-Layer PCB Junction-to-Board

Characterization Parameter (ΨJB) vs Copper Area

Figure 8-21. 4-Layer PCB Junction-to-Ambient

Thermal Resistance (RθJA) vs Copper Area

Figure 8-22. 4-Layer PCB Junction-to-Board

Characterization (ΨJB) Parameter vs Copper Area

8.2.4.5 Device Junction Temperature Estimation

For an ambient temperature of TA and total power dissipation (PTOT), the junction temperature (TJ) is calculated

as shown in the following equation. TJ = TA + (PTOT x RθJA)

Considering a JEDEC standard 4-layer PCB, the junction-to-ambient thermal resistance (RθJA) is 30.9 °C/W for

the HTSSOP package and 40.7 °C/W for the VQFN package.

Assuming 25°C ambient temperature, the junction temperature for the HTSSOP package is calculated as shown

below -

DRV8889-Q1

SLVSEE9C – APRIL 2020 – REVISED AUGUST 2020

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Numéro de pièce similaire - DRV8889-Q1_V02

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