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PACKAGE OUTLINE

C

8X

0.35

0.25

2.4 0.05

2X

1.95

1.65 0.05

6X 0.65

1 MAX

8X

0.5

0.3

0.05

0.00

A

3.1

2.9

B

3.1

2.9

(0.2) TYP

VSON - 1 mm max height

DRB0008B

PLASTIC SMALL OUTLINE - NO LEAD

4218876/A 12/2017

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

4

5

8

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 4.000

BUF634A

SBOS948D – FEBRUARY 2019 – REVISED SEPTEMBER 2020

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26

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