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EXAMPLE STENCIL DESIGN

8X (1.55)

8X (0.6)

6X (1.27)

(5.4)

(2.6)

(3.1)

BASED ON

0.127 THICK

STENCIL

4221637/B 03/2016

PowerPAD SOIC - 1.7 mm max height

DDA0008J

PLASTIC SMALL OUTLINE

2.20 X 2.62

0.175

2.37 X 2.83

0.150

2.6 X 3.1 (SHOWN)

0.125

2.91 X 3.47

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:10X

SYMM

SYMM

1

4

5

8

BASED ON

0.125 THICK

STENCIL

BY SOLDER MASK

METAL COVERED

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES