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NTP53X2 Fiches technique(PDF) 6 Page - NXP Semiconductors |
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NTP53X2 Fiches technique(HTML) 6 Page - NXP Semiconductors |
6 / 133 page NXP Semiconductors NTP53x2 NTAG 5 link - NFC Forum-compliant I2C bridge NTP53x2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved. Product data sheet Rev. 3.3 — 3 July 2020 COMPANY PUBLIC 544533 6 / 133 4 Ordering information Table 1. Ordering information Package Orderable part number Name Description Version NTP53121G0JHKZ XQFN16 NTAG 5 link; with I2C interface and 2048 bytes user EEPROM plastic, extremely thin quad flat package; no leads; 16 terminals SOT1161-2 NTP53121G0JTTZ TSSOP16 NTAG 5 link; with I2C interface and 2048 bytes user EEPROM plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body SOT403-1 NTP53121G0JTZ SO8 NTAG 5 link; with I2C interface and 2048 bytes user EEPROM plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body SOT96-1 NTP53121G0FUAV Wafer NTAG 5 link; 8 inch wafer, 150 µm thickness, on film frame carrier, electronic fail die marking according to SECS-II format) - NTP53321G0JHKZ XQFN16 NTAG 5 link with I2C master/slave interface, AES authentication and 2048 bytes user EEPROM plastic, extremely thin quad flat package; no leads; 16 terminals SOT1161-2 NTP53321G0JTTZ TSSOP16 NTAG 5 link with I2C master/slave interface, AES authentication and 2048 bytes user EEPROM plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body SOT403-1 NTP53321G0JTZ SO8 NTAG 5 link with I2C master/slave interface, AES authentication and 2048 bytes user EEPROM plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body SOT96-1 NTP53321G0FUAV Wafer NTAG 5 link; 8 inch wafer, 150 µm thickness, on film frame carrier, electronic fail die marking according to SECS-II format) - REMARK: Wafer specification addendum is available after exchange of a non-disclosure agreement (NDA) |
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