TM497BBK32, TM497BBK32S

4194304 BY 32-BIT

DYNAMIC RAM MODULE

SMMS433B – JANUARY 1993 – REVISED JUNE 1995

3

POST OFFICE BOX 1443

Table 1. Connection Table

DATA BLOCK

RASx

CASx

DQ0 – DQ7

RAS0

CAS0

DQ8 – DQ15

RAS0

CAS1

DQ16 – DQ23

RAS2

CAS2

DQ24 – DQ31

RAS2

CAS3

single-in-line memory module and components

PC substrate: 1,27

± 0,1 mm (0.05 inch) nominal thickness; 0.005 inch/inch maximum warpage

Bypass capacitors: Multilayer ceramic

Contact area for TM497BBK32: Nickel plate and gold plate over copper

Contact area for TM497BBK32S: Nickel plate and tin-lead over copper