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THS6222 Datasheet(Fiches technique) 20 Page - Texas Instruments

Numéro de pièce THS6222
Description  THS6222 8 V to 32 V, Differential Broadband HPLC Line Driver With Common-mode Buffer
Télécharger  41 Pages
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Fabricant  TI1 [Texas Instruments]
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THS6222 Datasheet(HTML) 20 Page - Texas Instruments

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Frequency (Hz)
VS = 12 V, no VCM capacitor
VS = 12 V, 100-nF VCM capacitor
VS = 32 V, no VCM capacitor
VS = 32 V, 100-nF VCM capacitor
Product Folder Links: THS6222
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Copyright © 2019–2020, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Common-Mode Buffer
The THS6222 is a differential line driver that features an integrated common-mode buffer. Most common line
driving applications for the THS6222 are ac-coupled applications; see Figure 64. Therefore, the inputs must be
common-mode shifted to ensure the input signals are within the common-mode specifications of the device. To
maximize the dynamic range, the common-mode voltage is shifted to midsupply in most ac-coupled applications.
With the integrated common-mode buffer, no external components are required to shift the input common-mode
voltage. Often, engineers choose to connect a noise-decoupling capacitor to the VCM pin. However, as shown in
Figure 53, assuming the circuit is reasonably shielded from external noise sources, no difference in common-
mode noise is observed with the 100 nF capacitor or without the capacitor.
Figure 53. Common-Mode Voltage Noise Density vs Frequency
There are ESD protection diodes in series directly at the output of the common-mode buffer between the internal
520 Ω resistor and the common-mode buffer output. These diodes are referenced to midsupply. Any voltage that
is 1.4 V above or below the midsupply applied to the VCM pin forward biases the protection diodes. This biasing
results in either current flowing into or out of the VCM pin. The current is limited by the 520 Ω resistor in series,
but to prevent permanent damage to the device, the current must be limited to the current specifications in the
Absolute Maximum Ratings table.
7.3.2 Thermal Protection and Package Power Dissipation
The THS6222 is designed with thermal protection that automatically puts the device in shutdown mode when the
junction temperature reaches approximately 175ºC. In this mode, the device behavior is the same as if the bias
pins are used to power-down the device. The device resumes normal operation when the junction temperature
reaches approximately 145ºC. In general, the thermal shutdown condition must be avoided. If and when the
thermal protection triggers, thermal cycling occurs where the device repeatedly goes in and out of thermal
shutdown until the junction temperature stabilizes to a value that prevents thermal shutdown.
A common technique to calculate the maximum power dissipation that a device can withstand is by using the
junction-to-ambient thermal resistance (RθJA), provided in the Thermal Information table. Using the equation
power dissipation = (junction temperature, TJ – ambient temperature, TA) / RθJA, the amount of power a package
can dissipate can be estimated. Figure 54 illustrates the package power dissipation based on this equation to
reach junction temperatures of 125ºC and 150ºC at various ambient temperatures. The RθJA value is determined
using industry standard JEDEC specifications and allows ease of comparing various packages. Power greater
than that in Figure 54 can be dissipated in a package by good printed circuit board (PCB) thermal design, using
heat sinks, and or active cooling techniques. See the Thermal Design By Insight, Not Hindsight application report
for an in-depth discussion on thermal design.

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