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MSP430F5310 Fiches technique(PDF) 92 Page - Texas Instruments

No de pièce MSP430F5310
Description  MSP430F5310, MSP430F530x Mixed-Signal Microcontrollers
Download  109 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

MSP430F5310 Fiches technique(HTML) 92 Page - Texas Instruments

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MSP430F5310, MSP430F5309, MSP430F5308, MSP430F5304
SLAS677G – SEPTEMBER 2010 – REVISED MAY 2020
www.ti.com
Submit Documentation Feedback
Product Folder Links: MSP430F5310 MSP430F5309 MSP430F5308 MSP430F5304
Device and Documentation Support
Copyright © 2010–2020, Texas Instruments Incorporated
7.4
Documentation Support
The following documents describe the MSP430F5310 and MSP430F530x devices. Copies of these
documents are available on the Internet at www.ti.com.
Receiving Notification of Document Updates
To receive notification of documentation updates—including silicon errata—go to the product folder for
your device on ti.com (for links to the product folders, see Table 7-2). In the upper right corner, click the
"Alert me" button. This registers you to receive a weekly digest of product information that has changed (if
any). For change details, check the revision history of any revised document.
Errata
MSP430F5310 Device Erratasheet Describes the known exceptions to the functional specifications for
the MSP430F5310 device.
MSP430F5309 Device Erratasheet Describes the known exceptions to the functional specifications for
the MSP430F5309 device.
MSP430F5308 Device Erratasheet Describes the known exceptions to the functional specifications for
the MSP430F5308 device.
MSP430F5304 Device Erratasheet Describes the known exceptions to the functional specifications for
the MSP430F5304 device.
User's Guides
MSP430F5xx and MSP430F6xx Family User's Guide
Detailed
information
on
the
modules
and
peripherals available in this device family.
MSP430 Flash Device Bootloader (BSL) User's Guide
The MSP430 bootloader (BSL) lets users
communicate with embedded memory in the MSP430 microcontroller during the prototyping
phase, final production, and in service. Both the programmable memory (flash memory) and
the data memory (RAM) can be modified as required. Do not confuse the bootloader with the
bootstrap loader programs found in some digital signal processors (DSPs) that automatically
load program code (and data) from external memory to the internal memory of the DSP.
MSP430 Programming With the JTAG Interface
This document describes the functions that are
required to erase, program, and verify the memory module of the MSP430 flash-based and
FRAM-based microcontroller families using the JTAG communication port. In addition, it
describes how to program the JTAG access security fuse that is available on all MSP430
devices. This document describes device access using both the standard 4-wire JTAG
interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).
MSP430 Hardware Tools User's Guide
This manual describes the hardware of the TI MSP-FET430
Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-
low-power microcontroller. Both available interface types, the parallel port interface and the
USB interface, are described.
Application Reports
MSP430 32-kHz Crystal Oscillators Selection of the right crystal, correct load circuit, and proper board
layout are important for a stable crystal oscillator. This application report summarizes crystal
oscillator function and explains the parameters to select the correct crystal for MSP430 ultra-
low-power operation. In addition, hints and examples for correct board layout are given. The
document also contains detailed information on the possible oscillator tests to ensure stable
oscillator operation in mass production.
MSP430 System-Level ESD Considerations System-level ESD has become increasingly demanding as
silicon technology scales to lower voltages and the need for designing cost-effective and
ultra-low-power components. This application report addresses three ESD topics to help
board designers and OEMs understand and design robust system-level designs: (1)
Component-level ESD testing and system-level ESD testing; (2) General design guidelines
for system-level ESD protection; (3) Introduction to System Efficient ESD Design (SEED), a
co-design methodology of on-board and on-chip ESD protection. A few real-world system-
level ESD protection design examples and their results are discussed.


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