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SI-3025ZD Datasheet(Fiches technique) 5 Page - Allegro MicroSystems

Numéro de pièce SI-3025ZD
Description  High-Current, Low-Dropout, 2.5 V Regulator
Télécharger  9 Pages
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Fabricant  ALLEGRO [Allegro MicroSystems]
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Logo ALLEGRO - Allegro MicroSystems

SI-3025ZD Datasheet(HTML) 5 Page - Allegro MicroSystems

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2.5 V Regulator
Input Capacitor (C
I, 0.1 F to 10 F). This is necessary
either when the input line includes inductance or when the
wiring is long.
Output Capacitor (C
O, > 47 F). This device is not
designed for a use with a very low ESR output capacitor
such as a ceramic capacitor. Output oscillation may occur
with that kind of capacitor.
Determination of DC Input Voltage. The minimum
input voltage V
I(min) should be higher than the sum of the
output voltage and the maximum rated dropout voltage.
Increased Output Voltage. The output voltage (V
may be increased by inserting a resistor (R
EXT) between
SENSE and OUTPUT. The current flowing into SENSE is
typically 90 A 30%. To minimize the effect of I
and temperature on R
EXT, it is recommended that a 6.8 k?
resistor be added between SENSE and GND to increase the
current in R
EXT. The value of REXT is then
EXT = (VO ? 2.5) 10
Overcurrent Protection. The SI-3000ZD series has a
built-in fold-back type overcurrent protection circuit, which
limits the output current at a start-up mode. It thus cannot
be used in applications that require current at the start-up
mode such as:
(1) constant-current load,
(2) power supply with positive and negative outputs to
common load (a center-tap type power supply), or
(3) raising the output voltage by putting a diode or a
resistor between the device ground and system ground.
Thermal Protection. Circuitry turns off the pass
transistor when the junction temperature rises above 135C.
It is intended only to protect the device from failures due to
excessive junction temperatures and should not imply that
output short circuits or continuous overloads are permitted.
Heat Radiation and Reliability. The reliability of the
IC is directly related to the junction temperature (T
J) in its
operation. Accordingly, careful consideration should be
given to heat dissipation.
The inner frame on which the integrated circuit is mounted
is connected to the GND terminal (pin 3). Therefore, it is
very effective for heat radiation to enlarge the copper area
that is connected to the GND terminal. The graph illus-
trates the effect of the copper area on the junction-to-
ambient thermal resistance (R?JA).
The junction temperature (T
J) can be determined from
either of the following equations:
J = (PD R
?JA) + TA
J = (PD R
?JT) + TT
where P
D = IO (VI ? VO) and
R?JT = 3C/W.
Parallel Operation. Parallel operation to increase load
current is not permitted.

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