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SI-3011ZF Fiches technique(PDF) 5 Page - Allegro MicroSystems

No de pièce SI-3011ZF
Description  HIgh-Current, Low-Dropout, 1.1~5V Regulator
Download  8 Pages
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Fabricant  ALLEGRO [Allegro MicroSystems]
Site Internet  http://www.allegromicro.com
Logo ALLEGRO - Allegro MicroSystems

SI-3011ZF Fiches technique(HTML) 5 Page - Allegro MicroSystems

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SI-3011ZF
High-Current,
Low-Dropout,
1.1~5 V Regulator
www.allegromicro.com
Linear
Regulators
5
APPLICATIONS INFORMATION
Input Capacitor (C
I, approximately 10 µF). This is
necessary either when the input line includes inductance or
when the wiring is long.
Output Capacitor (C
O, > 47 µF). This device is not
designed for a use with a very low ESR output capacitor
such as a ceramic capacitor. Output oscillation may occur
with that kind of capacitor.
Output Voltage Adjustable Resistors (R1 and R2).
The output voltage is adjusted by R1 and R2. 10 k
Ω or
11 k
Ω for R2 is recommended.
R1 = (V
O – Vref)/(Vref/R2)
For an output voltage of 1.8 V or less, add a 10 k
Ω resistor
between ADJ and the junction of R1 and R2.
Determination of DC Input Voltage. The minimum
input voltage V
I(min) should be higher than the sum of the
fixed output voltage and the maximum rated dropout
voltage. If setting the output voltage lower than 2.0 V, the
minimum input voltage should be more than 2.4 V.
Overcurrent Protection. The SI-3000ZD series has a
built-in fold-back type overcurrent protection circuit, which
limits the output current at a start-up mode. It thus cannot
be used in applications that require current at the start-up
mode such as:
(1) constant-current load,
(2) power supply with positive and negative outputs to
common load (a center-tap type power supply), or
(3) raising the output voltage by putting a diode or a
resistor between the device ground and system ground.
Thermal Protection. Circuitry turns off the pass
transistor when the junction temperature rises above 135°C.
It is intended only to protect the device from failures due to
excessive junction temperatures and should not imply that
output short circuits or continuous overloads are permitted.
Heat Radiation and Reliability. The reliability of the
IC is directly related to the junction temperature (T
J) in its
operation. Accordingly, careful consideration should be
given to heat dissipation. The graph on page 2 illustrates
the effect of thermal resistance on the allowable package
power dissipation.
When mounting to a heat sink, apply silicone grease (Shin-
Etsu Chemical G746, Dow Corning Toray Silicone SC102,
or Toshiba Silicone SY6260). Recommended mounting
hardware torque: 0.588 ~ 0.686 Nm or 6.0 ~ 7.0 kgf•cm
(4.34 ~ 5.06 lbf•ft).
The junction temperature (T
J) can be determined from
either of the following equations:
T
J = (PD × R
θJA) + TA
or
T
J = (PD × R
θJC) + TC
where P
D = IO × (VI – VO) and
RθJC = 5°C/W.
Parallel Operation. Parallel operation to increase load
current is not permitted.


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