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www.fairchildsemi.com

RMPA2271 Rev. B

PRELIMINARY

Applications Information

CAUTION: THIS IS AN ESD SENSITIVE DEVICE.

Precautions to Avoid Permanent Device Damage:

• Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. Devices should remain in their original packaging

until component placement to ensure no contamination or damage to RF, DC and ground contact areas.

• Device Cleaning: Standard board cleaning techniques should not present device problems provided that the boards are properly dried

to remove solvents or water residues.

• Static Sensitivity: Follow ESD precautions to protect against ESD damage:

–A properly grounded static-dissipative surface on which to place devices.

– Static-dissipative floor or mat.

–A properly grounded conductive wrist strap for each person to wear while handling devices.

• General Handling: Handle the package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoiding

damaging the RF, DC, and ground contacts on the package bottom. Do not apply excessive pressure to the top of the lid.

• Device Storage: Devices are supplied in heat-sealed, moisture-barrier bags. In this condition, devices are protected and require no

special storage conditions. Once the sealed bag has been opened, devices should be stored in a dry nitrogen environment.

Device Usage:

Fairchild recommends the following procedures prior to assembly.

• Dry-bake devices at 125°C for 24 hours minimum. Note: The shipping trays cannot withstand 125°C baking temperature.

• Assemble the dry-baked devices within 7 days of removal from the oven.

• During the 7-day period, the devices must be stored in an environment of less than 60% relative humidity and a maximum temperature

of 30°C

• If the 7-day period or the environmental conditions have been exceeded, then the dry-bake procedure must be repeated.