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Q1B685603M00D Fiches technique(PDF) 7 Page - Vishay Siliconix |
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Q1B685603M00D Fiches technique(HTML) 7 Page - Vishay Siliconix |
7 / 7 page www.vishay.com 133 ETQW Vishay Roederstein Document Number 42075 Revision 15-Aug-02 For technical questions, contact eurotant@vishay.com DESIGNATION SYMBOL DIMENSIONS (mm) Holding tape width W 18.0 (+ 1 / - 0.5) Adhesive tape width W0 Min. 5.0 Distance of components P 12.7 ± 1 Hole center to component center P2 6.35 ± 1.3 Hole center to lead P1 5.1 / 3.8 ± 0.7 Distance of body to hole center H*) 18.0 (+ 2 / - 0) Distance of lead to hole center H0 16.0 ± 0.5 Component upper edge to hole center H1 Max. 32.0 Adhesive tape location W2 Max. 3.0 Hole location W1 9.0 (+ 0.75 / - 0.5) Distance of holes P0 12.7 ± 0.3 Hole diameter D0 4.0 ± 0.3 Lead diameter d 0.5 ± 0.05 Component alignement ∆h Max. ± 2.0 Pitch F 2.5 / 5.0 (+ 0.6 / - 0.1) Holding tape thickness t 0.5 ± 0.2 Component alignement ∆P Max. ± 1.3 Length of snipped leads L Max. 11.0 TAPING ACCORDING TO IEC 286-2 (*) also available : 16mm and 20mm taping according to DIN-IEC 286 part 2 ∆h W2 D0 H0 W0 W1 W t P1 P2 H2 F P ∆P P2 P P1 F P0 L H Unreeling direction Resin-Coated, Radial-Leaded Tantalum Capacitors |
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