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AD4112 Fiches technique(PDF) 10 Page - Analog Devices |
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AD4112 Fiches technique(HTML) 10 Page - Analog Devices |
10 / 58 page AD4112 Data Sheet Rev. A | Page 10 of 58 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 3. Parameter Rating AVDD to AVSS −0.3 V to +6.5 V AVDD to DGND −0.3 V to +6.5 V IOVDD to DGND −0.3 V to +6.5 V IOVDD to AVSS −0.3 V to +7.5 V AVSS to DGND −3.25 V to +0.3 V VINx to AVSS −50 V to +50 V IINx+ to AVSS −0.3 V to AVDD + 0.3 V IINx− to AVSS −0.3 V to AVDD + 0.3 V Current Input Current1 −50 mA to +50 mA Reference Input Voltage to AVSS −0.3 V to AVDD + 0.3 V Digital Input Voltage to DGND −0.3 V to IOVDD + 0.3 V Digital Output Voltage to DGND −0.3 V to IOVDD + 0.3 V Digital Input Current 10 mA Operating Temperature Range −40°C to +105°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C Lead Soldering, Reflow Temperature 260°C 1 The absolute maximum current input current, current input voltage, and IINx− voltage must all be within the specified limits. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is specified for a device soldered on a JEDEC test board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA Unit CP-40-151 4-Layer JEDEC Board 34 °C/W 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test board with 16 thermal vias. See JEDEC JESD51. ESD CAUTION |
Numéro de pièce similaire - AD4112 |
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Description similaire - AD4112 |
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