MP7652 datasheet(5/16 Pages) EXAR

No de pièce	MP7652

Description	4-Channel Voltage Output 15 MHz, Input Bandwidth, 8-Bit Multiplying DACs with 3-Wire Serial Digital Port and Independent References

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Fabricant	EXAR [Exar Corporation]

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5 / 16 page

MP7652

5

Rev. 1.00

ELECTRICAL CHARACTERISTICS TABLE

Description

Symbol

Min

Typ

Max

Units

Conditions

DIGITAL TIMING

SPECIFICATIONS2, 4

Input Clock Pulse Width

tCH, tCL

60

ns

Data Setup Time

tDS

70

ns

Data Hold Time

tDH

0ns

CLK to SDO Propagation Delay

tPD

150

ns

DAC Register Load Pulse Width

tLD

100

ns

PRESET Pulse Width

tPR

50

ns

Clock Edge to Load Rising Edge

tCKLD1

100

ns

Clock Edge to Load Falling Edge

tCKLD2

0ns

Load Falling Edge to SDO

tHZ1

80

ns

Tri-state Enable

Load Rising Edge to SDO

tHZ2

40

ns

Tri-state Disable

Load Falling Edge to CLK Disable

tLDCK1

30

ns

Load Rising Edge to CLK Enable

tLDCK2

60

ns

LD Set-up Time with Respect

tLDSU

20

ns

to CLK

25

°C

NOTES

1

Full Scale Range (FSR) is 3V.

2

Guaranteed but not production tested.

3

Digital input levels should not go below ground or exceed the positive supply voltage, otherwise damage may occur.

4

See Figures 1 and 2.

5

For reference input pulse: tR = tF > 100 ns.

Specifications are subject to change without notice

ABSOLUTE MAXIMUM RATINGS (TA = +25

°C unless otherwise noted)1, 2

VCC to VREFN

+6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VEE to VREFN

–6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VCC to DGND

+13.0 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VEE to DGND

–6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VREFP 1-4 to DGND, VREFN

VCC to VEE

. . . . . . . . . . . . . . . . .

Digital Input & Output Voltage to DGND –0.5 to VDD +0.5 V

Operating Temperature Range

Extended Industrial

–40

°C to +85°C

. . . . . . . . . . . . . . . . . . .

Maximum Junction Temperature

–65

°C to 150°C

. . . . . . . . .

Storage Temperature

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . .

Lead Temperature (Soldering, 10 sec)

+300

°C

. . . . . . . . . . .

Package Power Dissipation Rating @ 75

°C

PDIP, SOIC

1000mW

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Derates above 75

°C

6mW/

°C

. . . . . . . . . . . . . . . . . . . . . .

NOTES:

1

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

2

Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps

(HP5082-2835) from input pin to the supplies.

All inputs have protection diodes which will protect the device from short

transients outside the supplies of less than 100mA for less than 100

µs.

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