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L6710 Fiches technique(PDF) 4 Page - STMicroelectronics |
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L6710 Fiches technique(HTML) 4 Page - STMicroelectronics |
4 / 34 page L6710 4/34 22 OSC/FAULT Oscillator pin. It allows programming the switching frequency of each channel: the equivalent switching frequency at the load side results in being doubled. Internally fixed at 1.24V, the frequency is varied proportionally to the current sunk (forced) from (into) the pin with an internal gain of 6kHz/ µA (See relevant section for details). If the pin is not connected, the switching frequency is 150kHz for each channel (300kHz on the load). The pin is forced high (5V Typ.) when an Over/Under Voltage is detected; to recover from these latched conditions, cycle VCC. 23 N.C. Not internally bonded. 24 to 29 VID0-5 Voltage IDentification pins. Internally pulled-up, connect to SGND to program a ‘0’ while leave floating to program a ‘1’. They are used to program the output voltage as specified in Table 1 and to set the PGOOD, OVP and UVP thresholds. Since the VID pins program the maximum output voltage, according to VRD10 specs, the device automatically regulates to a voltage VID* = VID–25mV avoiding use of any external component to lower the regulated voltage. 30 PGOOD This pin is an open collector output and is pulled low if the output voltage is not within the above-specified thresholds and during soft-start. It cannot be pulled up above 3.3V If not used may be left floating. 31 BOOT2 Channel 2 HS driver supply. This pin supplies the relative high side driver. Connect through a capacitor (100nF typ.) to the PHASE2 pin and through a diode to VCC (cathode vs. boot). 32 to 34 N.C. Not internally bonded. 35 HGATE2 Channel 2 HS driver output. A little series resistor helps in reducing device-dissipated power. 36 PHASE2 Channel 2 HS driver return path. It must be connected to the HS2 mosfet source and provides the return path for the HS driver of channel 2. 37 N.C. Not internally bonded. 38 LGATE2 Channel 2 LS driver output. A little series resistor helps in reducing device-dissipated power. 39 PGND LS drivers return path. This pin is common to both sections and it must be connected through the closest path to the LS mosfets source pins in order to reduce the noise injection into the device. 40 LGATE1 Channel 1 LS driver output. A little series resistor helps in reducing device-dissipated power. 41 VCCDR LS drivers supply: it can be varied from 5V to 12V buses. Filter locally with at least 1 µF ceramic cap vs. PGND. 42 PHASE1 Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and provides the return path for the HS driver of channel 1. 43 HGATE1 Channel 1 HS driver output. A little series resistor helps in reducing device-dissipated power. 44 N.C. Not internally bonded. PAD THERMAL PAD Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB to dissipate the power necessary to drive external mosfets. Connect to the GND plane with several vias to improve thermal conduction. PIN FUNCTION (continued) N Name Description |
Numéro de pièce similaire - L6710 |
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Description similaire - L6710 |
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