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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ITG-3400 Fiches technique(PDF) 34 Page - TDK Electronics |
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ITG-3400 Fiches technique(HTML) 34 Page - TDK Electronics |
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34 / 41 page  ITG-3400 Product Specification Document Number: PS-ITG-3400A-00 Revision: 1.0 Release Date: 12/24/2013 34 of 41 Package Gyro & Accel Axes ( ) Relative to PCB Axes ( ) with Orientation Errors ( Θ and Φ) ITG -34 00 Φ Θ X Y Z The table below shows the cross-axis sensitivity as a percentage of the gyroscope ’s sensitivity for a given orientation error, respectively. Cross-Axis Sensitivity vs. Orientation Error Orientation Error (θ or Φ) Cross-Axis Sensitivity (s inθ or sinΦ) 0º 0% 0.5º 0.87% 1º 1.75% The specifications for cross-axis sensitivity in Section 3.1 includes the effect of the die orientation error with respect to the package. 8.4.6 MEMS Handling Instructions MEMS (Micro Electro-Mechanical Systems) are a time-proven, robust technology used in hundreds of millions of consumer, automotive and industrial products. MEMS devices consist of microscopic moving mechanical structures. They differ from conventional IC products, even though they can be found in similar packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior to mounting onto printed circuit boards (PCBs). The ITG-3400 has been qualified to a shock tolerance of 10,000g. InvenSense packages its gyroscopes as it deems proper for protection against normal handling and shipping. It recommends the following handling precautions to prevent potential damage. Do not drop individually packaged gyroscopes, or trays of gyroscopes onto hard surfaces. Components placed in trays could be subject to g-forces in excess of 10,000g if dropped. Printed circuit boards that incorporate mounted gyroscopes should not be separated by manually snapping apart. This could also create g-forces in excess of 10,000g. Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if the bath energy causes excessive drive motion through resonant frequency coupling. |
Numéro de pièce similaire - ITG-3400 |
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Description similaire - ITG-3400 |
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