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GRM42A5C3F120FW01 Fiches technique(PDF) 18 Page - Murata Manufacturing Co., Ltd. |
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GRM42A5C3F120FW01 Fiches technique(HTML) 18 Page - Murata Manufacturing Co., Ltd. |
18 / 28 page 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade the capacitors. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board. 1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc. The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints. Provide support pins on the back side of the PCB to prevent warping or flexing. Install support pins as close to the test-probe as possible. 1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board. [Not Recommended] [Recommended] 7.Printed Circuit Board Cropping 1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that caused bending or twisting the board. 1-1. In cropping the board, the stress as shown may cause the capacitor to crack. Cracked capacitors may cause deterioration of the insulation resistance, and result in a short. Avoid this type of stress to a capacitor. [Bending] [Twisting] 2. Check the cropping method for the printed circuit board in advance. 2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router type separator, etc.) to prevent the mechanical stress that can occur to the board. * When a board separation jig or disc separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors may crack. Use router type separator if at all possible. Notes Hand and nipper separation apply a high level of stress. Use another method. · Board handling · Board bending direction · Layout of capacitors · Board handling · Layout of slits · Design of V groove · Arrangement of blades · Controlling blade life Board handling Level of stress on board High Medium Medium Low Recommended × △* △* ◯ Caution Board Separation Method Hand Separation Nipper Separation (1) Board Separation Jig Board Separation Apparatus 2) Disc Separator 3) Router Type Separator ! Peeling Test-probe Support Pin Test-probe ① 1A JEMCGC-05049F 18 |
Numéro de pièce similaire - GRM42A5C3F120FW01 |
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Description similaire - GRM42A5C3F120FW01 |
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