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ISD5116EY Datasheet(Fiches technique) 84 Page - Nuvoton Technology Corporation

Numéro de pièce ISD5116EY
Description  SINGLE-CHIP
Télécharger  90 Pages
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Fabricant  NUVOTON [Nuvoton Technology Corporation]
Site Internet  http://www.nuvoton.com
Logo NUVOTON - Nuvoton Technology Corporation

ISD5116EY Datasheet(HTML) 84 Page - Nuvoton Technology Corporation

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ISD5100 SERIES
Publication Release Date: Oct 31, 2008
- 84 -
Revision 1.42
11.7.
ISD5104 DIE INFORMATION
ISD5104
V
SSA
MIC +
MIC -
ANA OUT +
ANA OUT -
ACAP
SP -
V
SSA
[2]
SP +
V
CCA
[2]
ANA IN
AUX IN
AUX OUT
V
SSD
V
SSD
A0
SDA
A1
SCL
V
CCD
XCLK
RAC
V
SSA
INT
V
CCD
ISD5104 Device
Die Dimensions (include scribe line)
X: 4230 µm
Y: 5046 µm
Die Thickness [3]
292.1 µm ± 12.7 µm
Pad Opening
Single pad: 90 x 90 µm
Double pad: 180 x 90 µm
Notes
1.
The backside of die is internally connected to Vss. It MUST NOT be connected to any other potential or
damage may occur.
2.
Double bond recommended, if treated as single doubled-pad.
3.
This figure reflects the current die thickness. Please contact Nuvoton as this thickness may change in the
future.


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