I5116PY datasheet(80/90 Pages) NUVOTON

No de pièce	I5116PY

Description	SINGLE-CHIP

Download	90 Pages

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Fabricant	NUVOTON [Nuvoton Technology Corporation]

Site Internet	http://www.nuvoton.com

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ISD5100 SERIES

Publication Release Date: Oct 31, 2008

- 80 -

Revision 1.42

11.5.

ISD5116 DIE INFORMATION

≈

ISD5116

≈

V

SSA

MIC +

MIC -

ANA OUT +

ANA OUT -

ACAP

SP -

V

SSA

[2]

SP +

V

CCA

[2]

ANA IN

AUX IN

AUX OUT

V

SSD

V

SSD

A0

SDA

A1

SCL

V

CCD

XCLK

RAC

V

SSA

INT

V

CCD

ISD5116 Device

Die Dimensions

X: 4125 µm

Y: 8030 µm

Die Thickness [3]

292.1 µm ± 12.7 µm

Pad Opening

Single pad: 90 x 90 µm

Double pad: 180 x 90 µm

Notes

1.

The backside of die is internally connected to Vss. It MUST NOT be connected to any other potential or

damage may occur.

2.

Double bond recommended, if treated as single doubled-pad.

3.

This figure reflects the current die thickness. Please contact Nuvoton as this thickness may change in the

future.

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Winbond	I5116E	612Kb / 88P	SINGLE-CHIP 1 TO 16 MINUTES DURATION VOICE RECORD/PLAYBACK DEVICES WITH DIGITAL STORAGE CAPABILITY
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