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HMC500LP3 Datasheet(Fiches technique) 4 Page - Hittite Microwave Corporation

Numéro de pièce HMC500LP3
Description  GaAs HBT VECTOR MODULATOR 1.8 - 2.2 GHz
Télécharger  8 Pages
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Fabricant  HITTITE [Hittite Microwave Corporation]
Site Internet  http://www.hittite.com
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HMC500LP3 Datasheet(HTML) 4 Page - Hittite Microwave Corporation

   
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Absolute Maximum Ratings
RF Input (Vcc = +8V)
27 dBm
Supply Voltage (Vcc)
+10V
I & Q Input
-0.5V to +5.0V
Channel Temperature (Tc)
135 °C
Continuous Pdiss (T = 85°C)
(Derate 25 mW/°C above 85°C)
1.25 W
Thermal Resistance (R
th)
(junction to ground paddle)
40 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Typical Supply Current vs. Vcc
Note:
Modulator will operate over full voltage range shown above.
Vcc (V)
Icc (mA)
7.6
85
8.0
90
8.4
95
Outline Drawing
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC500LP3
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
500
XXXX
HMC500LP3E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
500
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST
BE SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
PCB LAND PATTERN.
GaAs HBT VECTOR
MODULATOR 1.8 - 2.2 GHz
v01.0705
HMC500LP3 / 500LP3E


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