HCPL-814-W00E datasheet(3/6 Pages) HP

No de pièce	HCPL-814-W00E

Description	AC Input Phototransistor Optocoupler High Density Mounting Type

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HCPL-814-300E

Solder Reflow Temperature Profile

1) One-time soldering reflow is

recommended within the

condition of temperature and

time profile shown at right.

2) When using another soldering

method such as infrared ray

lamp, the temperature may rise

partially in the mold of the

device. Keep the temperature on

the package of the device within

the condition of (1) above.

30 seconds

60 ~ 150 sec

90 sec

60 sec

25

°C

150

°C

200

°C

250

°C

260

°C (Peak Temperature)

217

°C

Time (sec)

Absolute Maximum Ratings

Parameters

Symbol

Min.

Max.

Units

Storage Temperature

TS

–55

125

˚C

Ambient Operating Temperature

TA

–30

100

˚C

Lead Solder Temperature for 10s

Tsol

260

˚C

(1.6 mm below seating plane)

Average Forward Current

IF

±50

mA

Input Power Dissipation

PI

70

mW

Collector Current

IC

50

mA

Collector-Emitter Voltage

VCEO

35

V

Emitter-Collector Voltage

VECO

6V

Collector Power Dissipation

PC

150

mW

Total Power Dissipation

Ptot

200

mW

Isolation Voltage

Viso

5000

Vrms

(AC for 1 minute, R.H. = 40 ~ 60%)[1]

6.5

± 0.5

(0.256)

DIMENSIONS IN MILLIMETERS AND (INCHES)

4.6

± 0.5

(0.181)

2.54

± 0.25

(0.1)

3.5

± 0.5

(0.138)

7.62

± 0.3

(0.3)

0.26

(0.010)

10.16

± 0.3

(0.4)

1.2

± 0.1

(0.047)

0.35

± 0.25

(0.014)

1.0

± 0.25

(0.039)

A 814

YW W

DATE CODE *1

RANK *2

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Description similaire - HCPL-814-W00E

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HCPL-814-W00E Fiches technique(PDF) 3 Page - Agilent(Hewlett-Packard)

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