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SBF-4089 Fiches technique(PDF) 1 Page - List of Unclassifed Manufacturers

No de pièce SBF-4089
Description  DC-500 MHz, Cascadable InGaP/GaAs HBT MMIC Amplifier
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Product Description
EDS-103412 Rev. C
303 South Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of
this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are
implied or granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc..
All worldwide rights reserved.
SBF-4089
SBF-4089Z
DC-500 MHz, Cascadable
InGaP/GaAs HBT MMIC Amplifier
Product Features
Available in Lead Free, RoHS compliant,
& Green packaging
• IP3 = 42dBm @ 240MHz
• Stable Gain Over Temperature
• Robust 1000V ESD, Class 1C
• Operates From Single Supply
• Low Thermal Resistance
Applications
• Receiver IF Amplifier
• Cellular, PCS, GSM, UMTS
• PA Driver Amp
• Wireless Data, Satellite Terminals
Sirenza Microdevices’ SBF-4089 is a high performance InGaP/
GaAs Heterojunction Bipolar Transistor MMIC Amplifier. A
Darlington configuration designed with InGaP process
technology provides broadband performance up to 0.5 GHz
with excellent thermal perfomance. The heterojunction
increases breakdown voltage and minimizes leakage current
between junctions. Cancellation of emitter junction non-
linearities results in higher suppression of intermodulation
products. Only a single positive supply voltage, DC-blocking
capacitors, a bias resistor, and an optional RF choke are
required for operation.
The matte tin finish on Sirenza’s lead-free package utilizes a
post annealing process to mitigate tin whisker formation and
is RoHS compliant per EU Directive 2002/95. This package is
also manufactured with green molding compounds that
contain no antimony trioxide nor halogenated fire retardants.
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Test Conditions:
V
S = 8 V
I
D = 90 mA Typ.
OIP
3 Tone Spacing = 1 MHz, Pout per tone = 0 dBm
R
BIAS = 33 Ohms
T
L = 25ºC
Z
S = ZL = 50 Ohms,
App circuit page 4.
S -P aram eters vs Freq uency +25c
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RoHS Compliant
&
Package
Green


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