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FP1F3P Fiches technique(PDF) 6 Page - NEC |
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FP1F3P Fiches technique(HTML) 6 Page - NEC |
6 / 8 page Data Sheet D16181EJ1V0DS 6 FP1 SERIES RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC sales representative. Surface MOUNTING TYPE For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). 6ROGHULQJ 0HWKRG 6ROGHULQJ &RQGLWLRQV 5HFRPPHQGHG &RQGLWLRQ 6\PERO ,QIUDUHG UHIORZ 3DFNDJH SHDN WHPSHUDWXUH °& 7LPH VHF PD[ DW °& RU KLJKHU &RXQW2QFH ([SRVXUH OLPLW 1RQH ,5 936 3DFNDJH SHDN WHPSHUDWXUH °& 7LPH VHF PD[ DW °& RU KLJKHU &RXQW2QFH ([SRVXUH OLPLW 1RQH 93 3DUWLDO KHDWLQJ 3LQWHPSHUDWXUH °& PD[7LPH VHF PD[([SRVXUH OLPLW 1RQH 2 * After opening the dry pack, store it at 25 °C or less and 65% RH or less for the allowable storage period. Cautions 1. Do not use different soldering methods together (except for partial heating). 2. Prevent the resin surface temperature from being higher than the board temperature by 20 °°°°C or more. |
Numéro de pièce similaire - FP1F3P |
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Description similaire - FP1F3P |
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