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SI-3033LUS Fiches technique(PDF) 3 Page - List of Unclassifed Manufacturers

No de pièce SI-3033LUS
Description  Surface-Mount, Low Current Consumption, Low Dropout Voltage Dropper Type
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Fabricant  ETC [List of Unclassifed Manufacturers]
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SI-3033LUS Fiches technique(HTML) 3 Page - List of Unclassifed Manufacturers

  SI-3033LUS Datasheet HTML 1Page - List of Unclassifed Manufacturers SI-3033LUS Datasheet HTML 2Page - List of Unclassifed Manufacturers SI-3033LUS Datasheet HTML 3Page - List of Unclassifed Manufacturers SI-3033LUS Datasheet HTML 4Page - List of Unclassifed Manufacturers  
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qSI-3000LUS Series
sBlock Diagram
sStandard External Circuit
sReference Data
CO: Output capacitor (10
µF or larger)
The SI-3000LUS series can be operated on the circuit
even if a low ESR ceramic capacitor is used as the
output capacitor.
CIN:Input capacitor (0.1 to 10
µF)
This capacitor is required in the case of an inductive
input line or long wiring.
• A monolithic IC is mounted. The inner frame stage is con-
nected to the GND pin (pin 2). Therefore, enlarging the
copper laminate area leading to the GND pin achieves a
heat radiation effect.
• How to calculate the junction temperature
Measure the temperature (TC) of the GND pin (pin 2) lead
section using a thermistor, etc. Substitute this value in the
following formula and calculate the junction temperature.
Tj=PD
×θj–c+Tc (θj–c=5°C/W)
REF
TSD
+
VIN
VO
GND
13
2
13
2
+
VIN
VIN
VO
CIN
CO
GND
+
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
100
1000
Copper Laminate Area (mm2)
Ta=25
°C
Ta=40
°C
Ta=60
°C
Ta=85
°C
Copper Laminate Area vs. Power Dissipation
Tj=100
°C PWB size 40 × 40


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