CM1425 datasheet(6/7 Pages) CALMIRCO

No de pièce	CM1425

Description	4 Channel EMI Filter Array with ESD Protection

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Fabricant	CALMIRCO [California Micro Devices Corp]

Site Internet	http://www.calmicro.com

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430 N. McCarthy Blvd., Milpitas, CA 95035-5112

▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 04/21/04

CM1425

PRELIMINARY

Mechanical Details

CM1425 devices are packaged in a custom Chip Scale

Packages (CSP) and available with optional Opti-

Guard

™ coating.

.

CM1425 9-bump CSP Mechanical Specifications

The CM1425 devices are packaged in a 9-bump cus-

tom Chip Scale Package (CSP). Dimensions are pre-

sented below.

Note 1: Applies to uncoated devices only.

Note 2: Applies to OptiGuard (coated) devices only.

Package Dimensions

CM1425 9-bump Chip Scale Package

PACKAGE DIMENSIONS

Package

Custom CSP

Bumps

9

Dim

Millimeters

Inches

Min

Nom

Max

Min

Nom

Max

A1

0.925

0.970

1.015

0.0364

0.0382

0.0400

A2

2.425

2.470

2.515

0.0955

0.0972

0.0990

B1

0.495

0.500

0.505

0.0195

0.0197

0.0199

B2

0.495

0.500

0.505

0.0195

0.0197

0.0199

C1

0.185

0.235

0.285

0.0073

0.0093

0.0112

C2

0.185

0.235

0.285

0.0073

0.0093

0.0112

D11

0.562

0.606

0.650

0.0221

0.0239

0.0256

D21

0.356

0.381

0.406

0.0140

0.0150

0.0160

D32

0.600

0.670

0.739

0.0236

0.0264

0.0291

D42

0.394

0.445

0.495

0.0155

0.0175

0.0195

# per tape

and reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

4

5

B

C1

B1

A1

D1

D2

BOTTOM VIEW

SIDE

VIEW

A

1

2

3

DIMENSIONS IN MILLIMETERS

A

B

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)

4

5

B

C1

B1

A1

D3

D4

BOTTOM VIEW

SIDE

VIEW

A

1

2

3

A

B

0.30 DIA.

63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)

OptiGuardTM

Coating

Non-coated CSP

OptiGuard

™ Coated CSP

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