ISL78200

FN7641 Rev 2.00

Page 8 of 22

December 24, 2013

Minimum Output Voltage

0.5

V

Slew Rate

SR

5

V/µs

PFM MODE CONTROL

Default PFM Current Threshold

MODE = VCC or floating

700

mA

INTERNAL HIGH-SIDE MOSFET

(Note 7)

90

150

mΩ

LOW-SIDE MOSFET GATE DRIVER

LGATE Source Resistance

100mA Source Current

3.5

Ω

LGATE Sink Resistance

100mA Sink Current

3.3

Ω

BOOST CONVERTER CONTROL

EXT_BOOST Boost_Turn-Off Threshold Voltage

0.74

0.8

0.86

V

EXT_BOOST Hysteresis Sink Current

2.4

3.2

3.8

µA

AUXVCC Boost Turn-Off Threshold Voltage

0.74

0.8

0.86

V

AUXVCC Hysteresis Sink Current

2.4

3.2

3.8

µA

POWER GOOD MONITOR

Overvoltage Rising Trip Point

Percentage of Reference Point

104

110

116

%

Overvoltage Rising Hysteresis

Percentage Below OV Trip Point

3

%

Undervoltage Falling Trip Point

Percentage of Reference Point

84

90

96

%

Undervoltage Falling Hysteresis

Percentage Above UV Trip Point

3

%

PGOOD Rising Delay

2

ms

PGOOD Leakage Current

10

nA

PGOOD Low Voltage

0.10

V

PROTECTION

Default Cycle by Cycle Current Limit Threshold

ILIMIT = GND or VCC or Floating

3

3.6

4.2

A

Hiccup Current Limit Threshold

115

%

OVERVOLTAGE PROTECTION

OV Latching-off Trip Point

Percentage of Reference Point

LG = UG = LATCH LOW

120

%

OV Non-Latching-off Trip Point

Percentage of Reference Point

LG = UG = LOW

110

%

OV Non-Latching-off Release Point

Percentage of Reference Point

102.5

%

OVER-TEMPERATURE PROTECTION

Over-Temperature Trip Point

155

°C

Over-Temperature Recovery Threshold

140

°C

NOTES:

6. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization

and are not production tested.

7. Wire bonds not included. The wire bond resistance between VIN and PHASE pin is 32mΩ typical.

Boldface limits apply over the operating temperature range, -40°C to +105°C. (Continued)

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

(Note 6)

TYP

MAX

(Note 6) UNITS