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BA82902YFJ-CE2 Fiches technique(PDF) 4 Page - Rohm |
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BA82902YFJ-CE2 Fiches technique(HTML) 4 Page - Rohm |
4 / 38 page 4/35 BA82904Yxxx-C BA82902Yxxx-C © 2017 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111 • 15 • 001 TSZ02201-0GLG0G200040-1-2 20.Feb.2018 Rev.007 Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) MSOP8 Junction to Ambient θJA 284.1 135.4 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 21 11 °C/W SOP8 Junction to Ambient θJA 197.4 109.8 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 21 19 °C/W SOP14 Junction to Ambient θJA 166.5 108.1 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 26 22 °C/W SSOP-B14 Junction to Ambient θJA 159.6 92.8 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 13 9 °C/W SOP-J14 Junction to Ambient θJA 118.5 67.2 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 10 10 °C/W TSSOP-B14J Junction to Ambient θJA 185.4 98.4 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 16 14 °C/W (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size 4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2mm x 74.2mm 35 μm 74.2mm x 74.2mm 70 μm |
Numéro de pièce similaire - BA82902YFJ-CE2 |
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Description similaire - BA82902YFJ-CE2 |
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