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SI-3025KS Datasheet(Fiches technique) 4 Page - List of Unclassifed Manufacturers

Numéro de pièce SI-3025KS
Description  Surface-Mount, Low Current Consumption, Low Dropout Voltage Dropper Type
Télécharger  7 Pages
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Fabricant  ETC [List of Unclassifed Manufacturers]
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SI-3025KS Datasheet(HTML) 4 Page - List of Unclassifed Manufacturers

  SI-3025KS Datenblatt HTML 1Page - List of Unclassifed Manufacturers SI-3025KS Datenblatt HTML 2Page - List of Unclassifed Manufacturers SI-3025KS Datenblatt HTML 3Page - List of Unclassifed Manufacturers SI-3025KS Datasheet HTML 4Page - List of Unclassifed Manufacturers SI-3025KS Datenblatt HTML 5Page - List of Unclassifed Manufacturers SI-3025KS Datenblatt HTML 6Page - List of Unclassifed Manufacturers SI-3025KS Datenblatt HTML 7Page - List of Unclassifed Manufacturers  
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sReference Data
Thermal resistance vs. Copper area
Power dissipation vs. Copper area
sExample of Solder Pattern Design
Symbol
Dimensions (mm)
e1
5.72
e
1.27
±0.15
α
0.2
β1
0.2 to 0.5
β2
0.2
L
0.6
b2
0.76
l2
L+
β1+β2
*1 The inner frame stage on which a monolithic IC is mounted is
directly connected to the GND pins (pins 5 through 8). By
expanding the area of the copper connected to the GND pins,
the heat radiation can be improved. It is recommended to
design the solder pattern by opening the insulation film of the
solder patterns of pins 5, 6, 7, and 8, on the wide GND
pattern as shown in Figure 1.
(Reference value conforming to EIAJ
Standard ED-7402-1)
• Calculating junction temperature
Measure the temperature TL of the lead of the GND pin (pin 7) by using a thermocouple, and substitute the
measured value into the following expression to calculate the junction temperature.
Tj=PD
× θj–L + TL
(
θj–L = 22°C/W)
qSI-3000KS Series
L
e
L
L
α
B1
B2
e
e1
b
e
ee
e
e1
l2
b2
*1
Figure 1
ee
e
8
GND pattern
1
7
2
6
3
5
b2
e1
l2
4
Copper area (mm2)
10
100
140
120
100
80
60
40
1000
Area of PC board : 40
×40mm
Copper area (mm2)
10
100
1.2
1
0.8
0.6
0.4
0.2
0
1000
Tj=100
°C Area of PC board : 40×40mm
Ta=25
°C
Ta=50
°C
Ta=80
°C


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