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TS19830CS Fiches technique(PDF) 2 Page - Taiwan Semiconductor Company, Ltd |
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TS19830CS Fiches technique(HTML) 2 Page - Taiwan Semiconductor Company, Ltd |
2 / 8 page TS19830CS Taiwan Semiconductor 2 Version: A1704 ABSOLUTE MAXIMUM RATINGS (Note 1) PARAMETER SYMBOL LIMIT UNIT Power Supply Pin VCC 40 V CS Voltage to GND VCS -0.3 to 5.5 V DRAIN Voltage to GND VDRAIN -0.3 to 500 V CS Voltage to GND VCS -0.3 to 5.5 V CL Voltage to GND VCL -0.3 to 5.5 V COM Voltage to GND VCOM -0.3 to 5.5 V Junction Temperature Range TJ -40 to +150 °C Storage Temperature Range TSTG -65 to +150 °C Lead Temperature (Soldering 10s) TLEAD 260 °C Power Dissipation @ TA=25 °C PD 0.6 W ESD Rating (Human Body Mode) (Note2) HBM 2 kV ESD Rating (Machine Mode) (Note 2) MM 200 V THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT Thermal Resistance - Junction to Case RӨJC 50 °C/W Thermal Resistance - Junction to Ambient RӨJA 208 °C/W Note: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board design. RӨJA shown below for single device operation on FR-4 PCB in still air. Thermal Resistance is specified with the component mounted on a low effective thermal conductivity test board in free air at TA=25°C. RECOMMENDED OPERATING CONDITIONS (Note 3) PARAMETER SYMBOL CONDITIONS UNIT Power Supply Pin VCC 33 V CL Voltage to GND VCL -0.3 to 0.3 V DRAIN Voltage to GND VDRAIN -0.3 to 500 V CS Voltage to GND VCS -0.3 to 5 V COM Voltage to GND VCOM -0.3 to 5 V Operating Junction Temperature Range TJ -40 to +125 °C Operating Ambient Temperature Range TOPA -40 to +85 °C |
Numéro de pièce similaire - TS19830CS |
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Description similaire - TS19830CS |
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