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TS68040DESC02XAA Fiches technique(PDF) 10 Page - ATMEL Corporation |
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TS68040DESC02XAA Fiches technique(HTML) 10 Page - ATMEL Corporation |
10 / 49 page 10 TS68040 2116A–HIREL–09/02 Thermal Considerations General Thermal Considerations This section is only given as user information. As microprocessors are becoming more complex and requiring more power, the need to efficiently cool the device becomes increasingly more important. In the past, the TS68000 Family, has been able to provide a 0-70°C ambient temperature part for speeds less than 40 MHz. However, the TS68040, which has a 50 MHz arithmetic logic unit (ALU) speed, is specified with a maximum power dissipation for a particular mode, a maximum junction temperature, and a thermal resistance from the die junction to the case. This provides a more accurate method of evaluating the environment, taking into consideration both the air-flow and ambient temperature available. This also allows a user the information to design a cooling method which meets both thermal performance requirements and constraints of the board environment. This section discusses the device characteristics for thermal management, several methods of thermal management, and an example of one method of cooling the TS68040. Thermal Device Characteristics The TS68040 presents some inherent characteristics which should be considered when evaluating a method of cooling the device. The following paragraphs discuss these die/package and power considerations. Die and Package The TS68040 is being placed in a cavity-down alumina-ceramic 179-pin PGA that has a specified thermal resistance from junction to case of 1°C/W. This package differs from previous TS68000 Family PGA packages which were cavity up. This cavity-down design allows the die to be attached to the top surface of the package, which increases the abil- ity of the part to dissipate heat through the package surface or an attached heat sink. The maximum perimeter that the TS68040 allows for a heat sink on its surface without interfering with the capacitor pads is 1.48" x 1.48". The specific dimensions and design of the particular heat sink will need to be determined by the system designer considering both thermal performance requirements and size requirements. Power Considerations The TS68040 has a maximum power rating, which varies depending on the operating frequency and the output buffer mode combination being used. The large buffer output mode dissipates more power than the small, and the higher frequencies of operation dissipate more power than the lower frequencies. The following paragraphs discuss trade-offs in using the different output buffer modes, calculation of specific maximum power dissipation for different modes, and the relationship of thermal resistances and temperatures. |
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