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TFA9842J Fiches technique(PDF) 17 Page - NXP Semiconductors |
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TFA9842J Fiches technique(HTML) 17 Page - NXP Semiconductors |
17 / 21 page Philips Semiconductors TFA9842J 2-channel audio amplifier (2 x SE or 1 x BTL) Preliminary data Rev. 01 — 26 April 2004 17 of 21 9397 750 12013 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 15. Package outline Fig 16. DBS9P package outline. REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. SOT523-1 0 10 mm 5 scale w M bp Dh q1 Z 19 e e1 m e2 x A2 non-concave D1 D P k q2 L3 L2 L Qc E 00-07-03 03-03-12 DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1 view B: mounting base side B UNIT bp L1 cD(1) Dh Lq2 mm 2.7 2.3 A2 (2) 0.80 0.65 0.58 0.48 13.2 12.8 D1 (2) 6.2 5.8 3.5 Eh 3.5 e 2.54 e1 1.27 e2 5.08 4.85 Q E(1) 14.7 14.3 Z(1) 1.65 1.10 11.4 10.0 L2 6.7 5.5 L3 4.5 3.7 3.4 3.1 1.15 0.85 q 17.5 16.3 q1 2.8 m 0.8 v 3.8 3.6 3 2 12.4 11.0 P k 0.02 x 0.3 w Eh L1 q v M |
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