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UC62LV2048JC Fiches technique(PDF) 9 Page - List of Unclassifed Manufacturers |
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UC62LV2048JC Fiches technique(HTML) 9 Page - List of Unclassifed Manufacturers |
9 / 9 page Low Power CMOS SRAM 128K X 16 UC62LV2048 -55/-70 PACKAGE DIMENSIONS θ TSOPII - 44 44 23 22 1 D e b Seating Plane "y" UNIT SYMBOL INCH MM A1 0.004±0.002 0.1±0.05 A 0.0433±0.004 1.10±0.1 A2 0.039±0.002 1.00±0.05 b 0.012 ~ 0.018 0.3 ~ 0.45 c 0.005 ~ 0.008 0.12 ~ 0.21 b1 0.012 ~ 0.016 0.3 ~ 0.4 D 0.725±0.004 18.41±0.1 c1 0.005 ~ 0.006 0.12 ~ 0.16 E1 0.463±0.008 11.76±0.20 E 0.400±0.004 10.16±0.1 e 0.0315±0.004 0.80±0.10 L1 0.0197±0.004 0.80±0.1 L 0.0197±0.004 0.50±0.1 0° ~ 8° 0° ~ 8° y 0.004 Max. 0.1 Max. θ DETAIL "A" (2:1) "A" A A L L1 b WITH PLATING c1 c b1 SECTION A-A BASE METAL D1 D ± 0.1 Fig. A S o ld er B a ll d ia m eter = 0 .3 5 ± 0.05 Fig . A B all p itch e= 0 .7 5 D E D1 E 1 8.0 6.0 5 .25 3 .75 Sid e V iew TO P V iew 48 M in i-B G A 6*8m m U-Chip Technology Corp. LTD. Preliminary Rev. 1.0 Reserves the right to modify document contents without notice. Page 9 |
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