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TPS3800-xx

TPS3801-xx

TPS3802-xx

SLVS219C – AUGUST 1999 – REVISED JULY 2003

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE OPTIONS

Device name

THRESHOLD VOLTAGE

TYP DELAY TIME

MARKING

TPS3801-01DCK

200 ms

ARF

TPS3801E18DCK

1.71 V

200 ms

ARE

TPS3801J25DCK

2.25 V

200 ms

NJA

TPS3800G27DCK

2.5 V

95 ms

ARI

TPS3801L30DCK

2.64 V

200 ms

NPA

-40

°C to 85°C

TPS3801K33DCK

2.93 V

200 ms

NWA

TPS3802L30DCK

2.64 V

380 ms

ASA

TPS3802K33DCK

2.93 V

380 ms

ARK

TPS3801T50DCK

4.00 V

25 ms

AVI

TPS3801I50DCK

4.55 V

200 ms

NSA

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted) (1) (2)

UNIT

7 V

All other pins

-0.3 V to 7 V

5 mA

-5 mA

±20 mA

±20 mA

-40

°C to 85°C

-65

°C to 150°C

Soldering temperature (3 seconds)

260

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND. For reliable operation, the device should not be operated at 7 V for more than t=1000h

continuously.

(3)

RECOMMENDED OPERATING CONDITIONS

min

max

unit

TPS3801J25, TPS3801L30,

TPS3801K33, TPS3801I50,

2

6

V

TPS3801T50

All other devices

1.6

4

0

V

0.7

×V

DD

V

0.3

×V

DD

V

Input transition rise and fall rate at MR,

∆t/∆V

100

ns/V

-40

85

°C

2