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AD9253-125EBZ Fiches technique(PDF) 7 Page - Analog Devices

No de pièce AD9253-125EBZ
Description  Serial LVDS 1.8 V Analog-to-Digital Converter
Download  41 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD9253-125EBZ Fiches technique(HTML) 7 Page - Analog Devices

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AD9253
Data Sheet
Rev. B | Page 6 of 40
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 4.
Parameter1, 2
Temp
Min
Typ
Max
Unit
CLOCK3
Input Clock Rate
Full
10
1000
MHz
Conversion Rate4
Full
10
80/105/125
MSPS
Clock Pulse Width High (tEH)
Full
6.25/4.76/4.00
ns
Clock Pulse Width Low (tEL)
Full
6.25/4.76/4.00
ns
OUTPUT PARAMETERS3
Propagation Delay (tPD)
Full
1.5
2.3
3.1
ns
Rise Time (tR) (20% to 80%)
Full
300
ps
Fall Time (tF) (20% to 80%)
Full
300
ps
FCO Propagation Delay (tFCO)
Full
1.5
2.3
3.1
ns
DCO Propagation Delay (tCPD)5
Full
tFCO + (tSAMPLE/16)
ns
DCO to Data Delay (tDATA)5
Full
(tSAMPLE/16) − 300
(tSAMPLE/16)
(tSAMPLE/16) + 300
ps
DCO to FCO Delay (tFRAME)5
Full
(tSAMPLE/16) − 300
(tSAMPLE/16)
(tSAMPLE/16) + 300
ps
Lane Delay (tLD)
90
ps
Data to Data Skew (tDATA-MAX − tDATA-MIN)
Full
±50
±200
ps
Wake-Up Time (Standby)
25°C
250
ns
Wake-Up Time (Power-Down)6
25°C
375
μs
Pipeline Latency
Full
16
Clock cycles
APERTURE
Aperture Delay (tA)
25°C
1
ns
Aperture Uncertainty (Jitter, tJ)
25°C
135
fs rms
Out-of-Range Recovery Time
25°C
1
Clock cycles
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
Measured on standard FR-4 material.
3
Can be adjusted via the SPI. The conversion rate is the clock rate after the divider.
4
The maximum conversion rate is based on two-lane output mode. See the Digital Outputs and Timing section for the maximum conversion rate in one-lane output mode.
5
tSAMPLE/16 is based on the number of bits in two LVDS data lanes. tSAMPLE = 1/fS.
6
Wake-up time is defined as the time required to return to normal operation from power-down mode.
TIMING SPECIFICATIONS
Table 5.
Parameter
Description
Limit
Unit
SYNC TIMING REQUIREMENTS
tSSYNC
SYNC to rising edge of CLK+ setup time
1.2
ns min
tHSYNC
SYNC to rising edge of CLK+ hold time
−0.2
ns min
SPI TIMING REQUIREMENTS
See Figure 74
tDS
Setup time between the data and the rising edge of SCLK
2
ns min
tDH
Hold time between the data and the rising edge of SCLK
2
ns min
tCLK
Period of the SCLK
40
ns min
tS
Setup time between CSB and SCLK
2
ns min
tH
Hold time between CSB and SCLK
2
ns min
tHIGH
SCLK pulse width high
10
ns min
tLOW
SCLK pulse width low
10
ns min
tEN_SDIO
Time required for the SDIO pin to switch from an input to an output relative to the
SCLK falling edge (not shown in Figure 74)
10
ns min
tDIS_SDIO
Time required for the SDIO pin to switch from an output to an input relative to the
SCLK rising edge (not shown in Figure 74)
10
ns min


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