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TSC83251G2D Fiches technique(PDF) 11 Page - TEMIC Semiconductors |
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TSC83251G2D Fiches technique(HTML) 11 Page - TEMIC Semiconductors |
11 / 28 page Qualpack TSC87251G2D Rev. 0 – October 1999 11 3.1 Change Procedure All changes are controlled by PCN (Product Change Notice). All major changes are notified to the customers affected by the change. A major change is defined as a change that requires evidence of no electrical, mechanical impact on the product, or a change in the specification or marking of the product or packing. The list of changes usually considered as major is detailed hereafter: 1 General Major Changes 1-1 Manufacturing line 1-2 Sequence of fabrication process cycle 1-3 Material type 1-4 Electrical parameter 1-5 External physical dimension 1-6 Die size 2 Changes specific to wafer fabrication area 2-1 Doping method 2-2 Gate oxide formation method 2-3 Equipment change 2-4 Layer Thickness 2-5 Module dimensions 3 Changes specific to to assembly process area 3-1 Sawing method 3-2 Die attach 3-3 Wire interconnect tools 3-4 Molding process 3-5 Tinning method 4 Changes specific to test area 4-1 Specification limit 4-2 Test coverage reduction 4-2 Product identification 4-3 Final conditioning |
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Description similaire - TSC83251G2D |
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