Qualpack TSC87251G2D

Rev. 0 – October 1999

11

3.1 Change Procedure

All changes are controlled by PCN (Product Change Notice). All major changes are notified to the

customers affected by the change.

A major change is defined as a change that requires evidence of no electrical, mechanical impact on the

product, or a change in the specification or marking of the product or packing. The list of changes usually

considered as major is detailed hereafter:

1

General Major Changes

1-1

Manufacturing line

1-2

Sequence of fabrication process cycle

1-3

Material type

1-4

Electrical parameter

1-5

External physical dimension

1-6

Die size

2

Changes specific to wafer fabrication area

2-1

Doping method

2-2

Gate oxide formation method

2-3

Equipment change

2-4

Layer Thickness

2-5

Module dimensions

3

Changes specific to to assembly process area

3-1

Sawing method

3-2

Die attach

3-3

Wire interconnect tools

3-4

Molding process

3-5

Tinning method

4

Changes specific to test area

4-1

Specification limit

4-2

Test coverage reduction

4-2

Product identification

4-3

Final conditioning