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RX110 Fiches technique(PDF) 2 Page - Renesas Technology Corp

No de pièce RX110
Description  32 MHz 32-bit RX MCUs, 50 DMIPS
Download  108 Pages
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Fabricant  RENESAS [Renesas Technology Corp]
Site Internet  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RX110 Fiches technique(HTML) 2 Page - Renesas Technology Corp

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R01DS0202EJ0120 Rev.1.20
Page 2 of 108
Jul 29, 2016
RX110 Group
1. Overview
1.
Overview
1.1
Outline of Specifications
Table 1.1 lists the specifications, and Table 1.2 gives a comparison of the functions of the products in different
packages.
Table 1.1 is for products with the greatest number of functions, so the number of peripheral modules and channels will
differ in accordance with the package type. For details, see Table 1.2, Comparison of Functions for Different
Packages.
Table 1.1
Outline of Specifications (1/3)
Classification
Module/Function
Description
CPU
CPU
 Maximum operating frequency: 32 MHz
 32-bit RX CPU
 Minimum instruction execution time: One instruction per one clock cycle
 Address space: 4-Gbyte linear
 Register set
General purpose: Sixteen 32-bit registers
Control: Eight 32-bit registers
Accumulator: One 64-bit register
 Basic instructions: 73
 DSP instructions: 9
 Addressing modes: 10
 Data arrangement
Instructions: Little endian
Data: Selectable as little endian or big endian
 On-chip 32-bit multiplier: 32-bit × 32-bit → 64-bit
 On-chip divider: 32-bit ÷ 32-bit → 32 bits
 Barrel shifter: 32 bits
Memory
ROM
 Capacity: 8 K /16 K /32 K /64 K /96 K /128 Kbytes
 32 MHz, no-wait memory access
 Programming/erasing method:
Serial programming (asynchronous serial communication), self-programming
RAM
 Capacity: 8 K /10 K /16 Kbytes
 32 MHz, no-wait memory access
MCU operating mode
Single-chip mode
Clock
Clock generation circuit
 Main clock oscillator, sub-clock oscillator, low-speed on-chip oscillator, high-speed on-chip oscillator,
and IWDT-dedicated on-chip oscillator
 Oscillation stop detection: Available
 Clock frequency accuracy measurement circuit (CAC)
 Independent settings for the system clock (ICLK), peripheral module clock (PCLK), and FlashIF clock
(FCLK)
The CPU and system sections such as other bus masters run in synchronization with the system
clock (ICLK): 32 MHz (at max.)
Peripheral modules run in synchronization with the PCLK: 32 MHz (at max.)
The flash peripheral circuit runs in synchronization with the FCLK: 32 MHz (at max.)
 The ICLK frequency can only be set to FCLK, PCLKB, or PCLKD multiplied by n (n: 1, 2, 4, 8, 16, 32,
64).
Resets
RES# pin reset, power-on reset, voltage monitoring reset, independent watchdog timer reset, and
software reset
Voltage detection
Voltage detection circuit
(LVDAa)
 When the voltage on VCC falls below the voltage detection level, an internal reset or internal interrupt
is generated.
Voltage detection circuit 1 is capable of selecting the detection voltage from 10 levels
Voltage detection circuit 2 is capable of selecting the detection voltage from 4 levels
Low power
consumption
Low power consumption
functions
 Module stop function
 Three low power consumption modes
Sleep mode, deep sleep mode, and software standby mode
Function for lower operating
power consumption
 Operating power control modes
High-speed operating mode, middle-speed operating mode, and low-speed operating mode
Interrupt
Interrupt controller (ICUb)
 Interrupt vectors: 65
 External interrupts: 9 (NMI, IRQ0 to IRQ7 pins)
 Non-maskable interrupts: 4 (NMI pin, voltage monitoring 1 interrupt, voltage monitoring 2 interrupt,
and IWDT interrupt)
 16 levels specifiable for the order of priority
DMA
Data transfer controller
(DTCa)
 Transfer modes: Normal transfer, repeat transfer, and block transfer
 Activation sources: Interrupts
 Chain transfer function


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