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LP5907 Fiches technique(PDF) 13 Page - Texas Instruments |
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LP5907 Fiches technique(HTML) 13 Page - Texas Instruments |
13 / 36 page EN IN OUT GND 1 PF 1 PF INPUT ENABLE GND OUTPUT LP5907 Copyright © 2016, Texas Instruments Incorporated 13 LP5907 www.ti.com SNVS798L – APRIL 2012 – REVISED SEPTEMBER 2016 Product Folder Links: LP5907 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated 8 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LP5907 is designed to meet the requirements of RF and analog circuits, by providing low noise, high PSRR, low quiescent current, and low line or load transient response figures. The device offers excellent noise performance without the need for a noise bypass capacitor and is stable with input and output capacitors with a value of 1 µF. The LP5907 delivers this performance in industry standard packages such as DSBGA, X2SON, and SOT-23 which, for this device, are specified with an operating junction temperature (TJ) of –40°C to 125°C. 8.2 Typical Application Figure 21 shows the typical application circuit for the LP5907. Input and output capacitances may need to be increased above the 1 µF minimum for some applications. Figure 21. LP5907 Typical Application 8.2.1 Design Requirements DESIGN PARAMETER EXAMPLE VALUE Input voltage range 2.2 V to 5.5 V Output voltage 1.8 V Output current 200 mA Output capacitor range 0.7 µF to 10 µF Input/Output capacitor ESR range 5 to 500 mΩ 8.2.2 Detailed Design Procedure 8.2.2.1 Power Dissipation and Device Operation The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus, the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die junction and ambient air. |
Numéro de pièce similaire - LP5907_17 |
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Description similaire - LP5907_17 |
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