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TMP006BIYZFR Fiches technique(PDF) 5 Page - Texas Instruments

No de pièce TMP006BIYZFR
Description  Infrared Thermopile Sensor in Chip-Scale Package
Download  38 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
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TMP006, TMP006B
www.ti.com
SBOS518E – MAY 2011 – REVISED APRIL 2015
7 Specifications
7.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage, VS
V+ pin
7
V
ADR1 pins
–0.5
VS + 0.5
V
Input voltage
SDA, SCL, DRDY, ADR0 pins
–0.5
+7
V
Input current
10
mA
Operating range
–40
+125
°C
Temperature
Junction temperature, TJ max
+150
°C
Storage range, Tstg
–65
+150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Electrostatic
V(ESD)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
V
discharge
Machine model
±200
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage, VS
2.5
3.3
5.5
V
Operating temperature range
–40
+125
°C
Die temperature, TDIE
125
°C
Object temperature, TOBJ
See note (1)
°C
(1)
Object temperature is application dependent.
7.4 Thermal Information
TMP006
TMP006B
THERMAL METRIC(1)
UNIT
YZF (DSBGA)
8 PINS
RθJA
Junction-to-ambient thermal resistance
123.8
RθJC(top)
Junction-to-case (top) thermal resistance
69
RθJB
Junction-to-board thermal resistance
103
°C/W
ψJT
Junction-to-top characterization parameter
4.7
ψJB
Junction-to-board characterization parameter
55
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2011–2015, Texas Instruments Incorporated
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