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TMP006BIYZFR Fiches technique(PDF) 5 Page - Texas Instruments |
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5 / 38 page TMP006, TMP006B www.ti.com SBOS518E – MAY 2011 – REVISED APRIL 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VS V+ pin 7 V ADR1 pins –0.5 VS + 0.5 V Input voltage SDA, SCL, DRDY, ADR0 pins –0.5 +7 V Input current 10 mA Operating range –40 +125 °C Temperature Junction temperature, TJ max +150 °C Storage range, Tstg –65 +150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 Electrostatic V(ESD) Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 V discharge Machine model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage, VS 2.5 3.3 5.5 V Operating temperature range –40 +125 °C Die temperature, TDIE 125 °C Object temperature, TOBJ See note (1) °C (1) Object temperature is application dependent. 7.4 Thermal Information TMP006 TMP006B THERMAL METRIC(1) UNIT YZF (DSBGA) 8 PINS RθJA Junction-to-ambient thermal resistance 123.8 RθJC(top) Junction-to-case (top) thermal resistance 69 RθJB Junction-to-board thermal resistance 103 °C/W ψJT Junction-to-top characterization parameter 4.7 ψJB Junction-to-board characterization parameter 55 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TMP006 TMP006B |
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