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SN74AVC4T245PW Fiches technique(PDF) 5 Page - Texas Instruments |
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SN74AVC4T245PW Fiches technique(HTML) 5 Page - Texas Instruments |
5 / 35 page SN74AVC4T245 www.ti.com SCES576G – JUNE 2004 – REVISED NOVEMBER 2014 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) (3) VCCI VCCO MIN MAX UNIT VCCA Supply voltage 1.2 3.6 V VCCB Supply voltage 1.2 3.6 V 1.2 V to 1.95 V VCCI × 0.65 High-level VIH Data inputs(4) 1.95 V to 2.7 V 1.6 V input voltage 2.7 V to 3.6 V 2 1.2 V to 1.95 V VCCI × 0.35 Low-level VIL Data inputs(4) 1.95 V to 2.7 V 0.7 V input voltage 2.7 V to 3.6 V 0.8 1.2 V to 1.95 V VCCA × 0.65 High-level DIR VIH 1.95 V to 2.7 V 1.6 V input voltage (referenced to VCCA) (5) 2.7 V to 3.6 V 2 1.2 V to 1.95 V VCCA × 0.35 Low-level DIR VIL 1.95 V to 2.7 V 0.7 V input voltage (referenced to VCCA) (5) 2.7 V to 3.6 V 0.8 VI Input voltage 0 3.6 V Active state 0 VCCO VO Output voltage V 3-state 0 3.6 1.2 V –3 1.4 V to 1.6 V –6 IOH High-level output current 1.65 V to 1.95 V –8 mA 2.3 V to 2.7 V –9 3 V to 3.6 V –12 1.1 V to 1.2 V 3 1.4 V to 1.6 V 6 IOL Low-level output current 1.65 V to 1.95 V 8 mA 2.3 V to 2.7 V 9 3 V to 3.6 V 12 Δt/Δv Input transition rise or fall rate 5 ns/V TA Operating free-air temperature –40 85 °C (1) VCCI is the VCC associated with the input port. (2) VCCO is the VCC associated with the output port. (3) All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). (4) For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V (5) For VCCI values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V 6.4 Thermal Information SN74AVC4T245 THERMAL METRIC(1) D DGV PW RGY RSV UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 85.5 126.0 112.0 37.5 146.9 RθJC(top) Junction-to-case (top) thermal resistance 46.9 50.8 46.8 54.5 53.6 RθJB Junction-to-board thermal resistance 43.0 57.7 57.1 15.6 75.6 °C/W ψJT Junction-to-top characterization parameter 13.4 5.7 5.7 0.5 13.5 ψJB Junction-to-board characterization parameter 42.7 57.2 56.5 15.8 75.6 RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 3.5 — (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). Copyright © 2004–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: SN74AVC4T245 |
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