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TMP468AIYFFR Fiches technique(PDF) 1 Page - Texas Instruments |
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TMP468AIYFFR Fiches technique(HTML) 1 Page - Texas Instruments |
1 / 43 page D3+ D4+ SCL SDA THERM ADD V+ THERM2 D3 C1 D1 D4 C4 B4 TMP468 C3 B3 D5+ D6+ A2 B2 D1+ D2+ D- D7+ A1 B1 C2 A3 GND A4 D8+ D2 CDIFF RS1 RS2 CDIFF RS1 RS2 CDIFF RS1 RS2 CDIFF RS1 RS2 CDIFF RS1 RS2 CDIFF RS1 RS2 CDIFF RS1 RS2 CDIFF RS1 RS2 1.7V to 3.6V CBYPASS RSCL RSDA RT RT2 2-Wire Interface SMBus/I2C Compatible Cotnroller Over- Temperature Shutdown Local Zone 9 Remote Zone 1 Remote Zone 2 Remote Zone 3 Remote Zone 4 Remote Zone 8 Remote Zone 7 Remote Zone 6 Remote Zone 5 Product Folder Sample & Buy Technical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP468 SBOS762 – NOVEMBER 2016 TMP468 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor 1 1 Features 1 • 8-Channel Remote Diode Temperature Sensor Accuracy: ±0.75°C • Local Temperature Sensor Accuracy: ±0.35°C • Temperature Resolution: 0.0625°C • Supply and Logic Voltage Range: 1.7 V to 3.6 V • 67-µA Operating Current (1 SPS, All Channels Active) • 0.3-µA Shutdown Current • Remote Diode: Series Resistance Cancellation, η-Factor Correction, Offset Correction, and Diode Fault Detection • Register Lock Function Secures Key Registers • I2C- or SMBus™-Compatible Two-Wire Interface With Pin-Programmable Address • 16-Bump DSBGA Package 2 Applications • MCU, GPU, ASIC, FPGA, DSP, and CPU Temperature Monitoring • Telecommunication Equipment • Servers and Personal Computers • Cloud Ethernet Switches • Secure Data Centers • Highly Integrated Medical Systems • Precision Instruments and Test Equipment • LED Lighting Thermal Control 3 Description The TMP468 device is a multi-zone, high-accuracy, low-power temperature sensor using a 2-wire, SMBus- or I2C-compatible interface. Up to eight remote diode-connected temperature zones can be monitored simultaneously in addition to the local temperature. Aggregating the temperature measurements across a system allow improved performance through tighter guard bands and can also reduce board complexity. A typical use case is for monitoring the temperature across different processors, such as MCUs, GPUs, and FPGAs in complex systems such as servers and telecommunications equipment. Advanced features such as series resistance cancellation, programmable non-ideality factor, programmable offset, and programmable temperature limits are included to provide a robust thermal monitoring solution with improved accuracy and noise immunity. Each of the 8 remote channels (and the local channel) can be programmed independently with two thresholds which trigger when the corresponding temperature is exceeded at the measured location. In addition, there is a programmable hysteresis setting to avoid constant toggling of the threshold. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TMP468 DSBGA (16) 1.60 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Note: See section Design Requirements for remote diode recommendations (most common discrete transistor recommendation is MMBT3904). Place remote diode differential filter capacitors close to TMP468 pins. Unused diode channels must be tied to D–. Remote diode filter capacitor and the sum of the series resistance (RS1 + RS2) values must be less than 1 nF and 1 kΩ, respectively. |
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