0.8500±0.0250 (x2)

non plated alignment hole

1.7000±0.1000 (x4)

non plated mounting hole

0.4200 pad (x225)

20.7250 backing plate size

18.6000 socket size

18.2250

socket

size

1.2500

1.2500

2.5000

2.5000

2.7825

5.3225

8.0500

7.6750

7.8625 (x2)

2.6375

2.2625

11.2000

0.8000

0.8000

A1 corner

* Note: BGA pattern is not symmetrical

with respect to the mounting holes.

BGA array is shifted 0.375mm to the

right of center.

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: same or higher than solder mask

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance

±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 12/04/2015

Material:

Finish:

Weight:

SM-BGA-9063 Drawing

SCALE: 5:1

SHEET: 2 OF 5

ENG: E. Smolentseva

FILE: SM-BGA-9063 Dwg

DRAWN BY: M. Raske