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SS-BGA1156A-01 Fiches technique(PDF) 3 Page - Ironwood Electronics. |
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SS-BGA1156A-01 Fiches technique(HTML) 3 Page - Ironwood Electronics. |
3 / 5 page D E Øb TOP VIEW SIDE VIEW Compatible BGA Spec BOTTOM VIEW e DIM MIN MAX A 2.6 A1 0.4 0.6 b 0.7 D E e 35.0 BSC 35.0 BSC 1.00 BSC Array 34x34 0.5 DETAIL Ø0.25 Ø0.10 Z X Y Z X Y Dimensions are in millimeters. Interpret dimensions and toleraces per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. 5 4 3 0.20 3 5 4 A A1 DETAIL 0.2 Z Z 0.20 Z PAGE 3 of 5 Status: Preliminary Drawing: H. Hansen Scale: Rev: A Date: 9/9/05 Modified: File: SS-BGA1156A-01 Dwg SS-BGA1156A-01 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com |
Numéro de pièce similaire - SS-BGA1156A-01 |
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Description similaire - SS-BGA1156A-01 |
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