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MC34063 Datasheet(Fiches technique) 12 Page - ON Semiconductor

Numéro de pièce MC34063
Description  DC-to-DC Converter Control Circuits
Télécharger  16 Pages
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Fabricant  ONSEMI [ON Semiconductor]
Site Internet  http://www.onsemi.com
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 12 page
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MC34063A, MC33063A
http://onsemi.com
12
PACKAGE DIMENSIONS
SEATING
PLANE
1
4
5
8
A
0.25 M CB SS
0.25 M B M
h
q
C
X 45
_
L
DIM
MIN
MAX
MILLIMETERS
A
1.35
1.75
A1
0.10
0.25
B
0.35
0.49
C
0.19
0.25
D
4.80
5.00
E
1.27 BSC
e
3.80
4.00
H
5.80
6.20
h
0
7
L
0.40
1.25
q
0.25
0.50
_
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
PDIP–8
P, P1 SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
SO–8
D SUFFIX
PLASTIC PACKAGE
CASE 751–06
ISSUE T
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MIN
MIN
MAX
MAX
MILLIMETERS
INCHES
DIM
9.40
6.10
3.94
0.38
1.02
0.76
0.20
2.92
0.76
10.16
6.60
4.45
0.51
1.78
1.27
0.30
3.43
0.370
0.240
0.155
0.015
0.040
0.030
0.008
0.115
0.030
0.400
0.260
0.175
0.020
0.070
0.050
0.012
0.135
10°
1.01
2.54 BSC
7.62 BSC
0.100 BSC
0.300 BSC
A
B
C
D
F
G
H
J
K
L
M
N
10°
0.040
F
H
G
D
N
C
K
M
J
L
NOTE 2
1
4
5
8
T
0.13 (0.005)
AB
M
M
M
–A–
–B–
–T–
SEATING
PLANE




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