ISL58327

3

FN6577.2

July 29, 2013

Pin Configuration

ISL58327

(9 BALL OCSP)

TOP VIEW

3

2

1

B

A

C

VDD

OUTN

OUTP

VSS

HL

VREF

A0

SCL

SDA

PD

Pin Descriptions

PIN NUMBER

PIN NAME

TYPE

DESCRIPTION

A1

SDA

Digital I/O

B1

VREF

Analog Input

Reference voltage input

C1

OUTP

Analog Output

Positive swing analog output

A2

SCL

Digital Input

Serial interface clock

B2

HL

Digital Input

HIGH/LOW gain mode selection, H = High gain, L = Low Gain.

Use in conjunction with Reg 0x10 bit 7.

* For hard switching, Reg 0x10 bit 7 must be set to 1.

* For soft switching, this pin must be High.

C2

OUTN

Analog Output

Negative swing analog output

A3

A0

Digital Input

B3

VSS

Power

GND

C3

VDD

Power

+5.0V supply

-

PD

Optical input

Photo diode

Ordering Information

PART NUMBER

(Notes 1, 2, 3, 4)

PACKAGE

Tape & Reel

(Pb-free)

PKG.

DWG. #

ISL58327CIZ-T7

9 Ball OCSP

S3x3.9

ISL58327CIZ-T7A

9 Ball OCSP

S3x3.9

NOTES:

1. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free WLCSP and BGA packaged products employ special Pb-free material sets; molding compounds/die attach materials and

SnAgCu - e1 solder ball terminals, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free

WLCSP and BGA packaged products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J STD-020.

3. Please refer to TB478 for solder profile.

4. For Moisture Sensitivity Level (MSL), please see device information page for ISL58327. For more information on MSL please see tech brief TB363.