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Moteur de recherche de fiches techniques de composants électroniques |
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LYGT67K-JL-1-HK-1 Datasheet(Fiches technique) 13 Page - OSRAM GmbH |
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13 page ![]() LYG T67K 2016-10-04 13 Lötbedingungen Soldering Conditions Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01 Profile Feature Pb-Free (SnAgCu) Assembly Recommendation Max. Ratings Ramp-up Rate to Preheat* ) 25°C to 150°C 2°C / sec 3°C / sec Time t s from TSmin to TSmax (150°C to 200°C 100s min. 60sec max. 120sec Ramp-up Rate to Peak*) 180°C to T P 2°C / sec 3°C / sec Liquidus Temperture T L 217°C Time t L above TL 80sec max. 100sec Peak Temperature T P 245°C max. 260°C Time t P within 5°C of the specified peak temperature T P - 5K 20sec min. 10sec max. 30sec Ramp-down Rate* T P to 100°C 3°K / sec 6°K / sec maximum Time 25°C to Peak temperature max. 8 min. All temperatures refer to the center of the package, measured on the top of the component * slope calculation ∆T/∆t: ∆t max. 5 sec; fulfillment for the whole T-range 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C S t t P t T p 240 ˚C 217 ˚C 245 ˚C 25 ˚C L |
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