LYG T67K

2016-10-04

13

Lötbedingungen

Soldering Conditions

Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01

Profile Feature

Pb-Free (SnAgCu) Assembly

Recommendation

Max. Ratings

Ramp-up Rate to Preheat*

)

25°C to 150°C

2°C / sec

3°C / sec

Time t

(150°C to 200°C

100s

min. 60sec max. 120sec

180°C to T

P

2°C / sec

3°C / sec

Liquidus Temperture T

L

217°C

Time t

80sec

max. 100sec

Peak Temperature T

P

245°C

max. 260°C

Time t

peak temperature T

20sec

min. 10sec max. 30sec

Ramp-down Rate*

T

3°K / sec

6°K / sec maximum

Time 25°C to Peak temperature

max. 8 min.

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation

∆T/∆t: ∆t max. 5 sec; fulfillment for the whole T-range

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L