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LYG5AP-CXDX-36-1 Fiches technique(PDF) 13 Page - OSRAM GmbH |
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LYG5AP-CXDX-36-1 Fiches technique(HTML) 13 Page - OSRAM GmbH |
13 / 21 page LY G5AP 2011-05-04 13 Reflow Soldering Profile Reflow Lötprofil Preconditioning: JEDEC Level 4 acc. to JEDEC S-STD-020-D 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C S t t P t T p 240 ˚C 217 ˚C 245 ˚C 25 ˚C L OHA04612 Profil-Charakteristik Profile Feature Ramp-up Rate to Preheat*) 25 ˚C ≤ T ≤ 150 ˚C 2 3 K/s Time from T Smin to TSmax 150 ˚C ≤ T S ≤ 200 ˚C t S t L t P T L T P 100 120 60 10 20 30 80 100 217 23 245 260 36 Time 25 ˚C ≤ T ≤ T P Time within 5 ˚C of the specified peak temperature T P - 5 K Ramp-down Rate* T P ≤ T ≤ 100 ˚C All temperatures refer to the center of the package, measured on the top of the component * slope calculation ΔT/Δt: Δt max. 5 s; fulfillment for the whole T-range Ramp-up Rate to Peak*) T Smax ≤ T ≤ TP Liquidus Temperature Peak Temperature Time above Liquidus temperature Symbol Symbol Einheit Unit Pb-Free (SnAgCu) Assembly Minimum Maximum Recommendation K/s K/s s s s s ˚C ˚C 480 |
Numéro de pièce similaire - LYG5AP-CXDX-36-1 |
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Description similaire - LYG5AP-CXDX-36-1 |
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